? semiconductor components industries, llc, 2011 october, 2011 ? rev. 6 1 publication order number: bas20ht1/d bas20ht1, SBAS20HT1G high voltage switching diode features ? aec ? q101 qualified and ppap capable ? s prefix for automotive and other applications requiring unique site and control change requirements ? these devices are pb ? free, halogen free/bfr free and are rohs compliant maximum ratings rating symbol value unit continuous reverse voltage v r 200 vdc repetitive peak reverse voltage v rrm 200 vdc continuous forward current i f 200 madc peak forward surge current i fm(surge) 625 madc repetitive peak forward current i frm 500 ma non ? repetitive peak forward current (square wave, t j = 25 c prior to surge) t = 1 s t = 1 ms t = 1 s i fsm 5.0 2.0 0.5 a thermal characteristics characteristic symbol max unit total device dissipation fr ? 5 board* t a = 25 c derate above 25 c p d 200 1.57 mw mw/ c thermal resistance junction ? to ? ambient r ja 635 c/w junction and storage temperature range t j , t stg ? 55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. *fr ? 5 minimum pad electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics reverse voltage leakage current (v r = 200 vdc) (v r = 200 vdc, t j = 150 c) i r ? ? 1.0 100 adc reverse breakdown voltage (i br = 100 adc) v (br) 250 ? vdc forward voltage (i f = 100 madc) (i f = 200 madc) v f ? ? 1000 1250 mv diode capacitance (v r = 0, f = 1.0 mhz) c d ? 5.0 pf reverse recovery time (i f = i r = 30 madc, r l = 100 ) t rr ? 50 ns http://onsemi.com high voltage switching diode device package shipping ? ordering information sod ? 323 case 477 style 1 1 cathode 2 anode marking diagram jr = specific device code m = date code* = pb ? free package 1 2 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. jr m bas20ht1g sod ? 323 (pb ? free) 3000 / tape & reel (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location. SBAS20HT1G sod ? 323 (pb ? free) 3000 / tape & reel
bas20ht1, SBAS20HT1G http://onsemi.com 2 notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 30 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 30 ma. notes: 3. t p ? t rr +10 v 2.0 k 820 0.1 f d.u.t. v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 3.0 ma output pulse (i f = i r = 30 ma; measured at i r(rec) = 3.0 ma) i f input signal figure 1. recovery time equivalent test circuit figure 2. forward current figure 3. leakage current 1000 i v f , forward voltage (v) 0.1 0.2 0.4 0.6 100 10 1.0 0.8 1.0 1.2 1.4 0 100 i v r , reverse voltage (v) 1.0 0.001 50 0 10 0.1 100 150 200 250 0.01 300 125 c 150 c ? 40 c 25 c 55 c , reverse current ( a) r , forward current (ma) f 125 c 150 c ? 40 c 25 c 55 c figure 4. total capacitance 2.0 c v r , reverse voltage (v) 0 5.0 10 15 1.8 0.4 0.2 20 25 30 35 0 , total capacitance (pf) t 0.8 0.6 1.2 1.0 1.6 1.4 f = 1 mhz ie = 0 a t a = 25 c
bas20ht1, SBAS20HT1G http://onsemi.com 3 package dimensions h e sod ? 323 case 477 ? 02 issue h notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c note 5 l 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 1: pin 1. cathode (polarity band) 2. anode on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 bas20ht1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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